Short answer: Leaks point to the Pixel 11 series shipping with a Tensor G6 chip built on TSMC's 2nm process — reportedly the first phone chip to use that node, ahead of even Apple's next iPhone — paired with a new seven-core CPU arrangement, a new PowerVR GPU, and a redesigned image processing pipeline codenamed "Metis" alongside a new AI TPU codenamed "Santafe". On the camera side, rumours point to a new 50MP main sensor (codenamed "chemosh") on the base Pixel 11, up from the Pixel 10's 48MP, with the Pixel 11 Pro and Pro XL reportedly getting brand-new main and telephoto sensors codenamed "bastet" and "barghest", plus a redesigned telephoto module and zoom figures as high as 30x referenced in leaked marketing material. None of this is confirmed. Google's Made by Google event is scheduled for 12 August 2026, with retail availability expected shortly after. Until then, everything below is leak and rumour, clearly flagged as such.
E-Tech61 is a parts supplier, not a repair shop, and we currently hold zero Pixel 11 stock — there's nothing to buy from us for this phone yet. This article exists because the Tensor G6 and camera rumours are genuinely interesting from a specs and repair-complexity standpoint, and we think enthusiasts researching "what's actually changing" deserve a properly sourced, hedged breakdown rather than another speculative round-up. For release date, pricing and storage tier rumours, see our full Pixel 11 series overview. For help deciding which model might suit you once specs are confirmed, see our Pixel 11 tier comparison.
Tensor G6: the rumoured jump to 2nm
The headline rumour is the manufacturing process. Leaks describe the Tensor G6 as being built on TSMC's N2 (2-nanometre-class) node, continuing Google's move away from Samsung Foundry that began with the Tensor G5 on TSMC's 3nm process for the Pixel 10. If accurate, this would reportedly make the Tensor G6 one of the first smartphone chips to ship on a genuine 2nm process, ahead of rival flagship silicon expected later in the year.
In general chip design terms — and this part isn't Pixel-specific speculation, it's how semiconductor scaling works — a smaller process node typically means more transistors can be packed into the same die area, with each transistor switching using less energy and leaking less current when idle. That combination tends to deliver either more performance at the same power draw, the same performance at lower power draw, or some blend of both, depending on how the manufacturer tunes clock speeds and voltages. It's exactly why Apple, Qualcomm and Samsung all chase leading-edge nodes for their flagship chips. Whether Google fully cashes in that efficiency dividend on the Tensor G6, or spends most of it on higher clock speeds and heavier on-device AI workloads instead, is the real open question — Tensor chips have historically run warmer and less efficiently than rival flagship silicon despite competitive nodes, so the 2nm shift alone won't guarantee dramatically better battery life.
Rumoured CPU and GPU changes
Leaked specifications describe a seven-core CPU built around Arm's newer C1-series cores — reportedly the first Arm CPU family based on the Armv9.3 architecture — arranged as one C1-Ultra core clocked around 4.11GHz, four C1-Pro cores around 3.38GHz, and two further C1-Pro cores around 2.65GHz. Early leaked Geekbench figures reportedly put single-core performance meaningfully ahead of the Tensor G5, though multi-core gains are less clear and some leaks note the Tensor G6 actually drops to seven cores from the Tensor G5's eight — one fewer core, even with the newer architecture.
The GPU story is murkier and worth flagging honestly rather than glossing over. Leaks point to a PowerVR CXTP-48-1536 GPU from Imagination Technologies. The "P" suffix reportedly denotes a power-optimised variant, but the underlying design is from Imagination's older C-Series, whereas the Tensor G5 already used the newer D-Series (DXT-48-1536). Taken at face value, that would mean stepping back a GPU design generation even while moving forward a process node — some commentators covering the leak have called this a potential misstep for sustained gaming and graphics performance. It's not confirmed, and Google could tune the C-Series implementation to outperform expectations, but it's a rumour worth tempering excitement around rather than assuming an automatic generational leap in graphics.
New ISP and NPU: what "Metis" and "Santafe" could mean
Two codenames worth watching: a new custom image signal processor reportedly called "Metis", and a new dedicated AI accelerator (TPU) reportedly called "Santafe". If accurate, a new ISP generation would sit directly upstream of every camera feature the Pixel line is known for — Night Sight, Super Res Zoom, video HDR and real-time computational adjustments all depend on how much processing headroom the ISP has before the TPU even gets involved. A more capable on-device TPU, meanwhile, is the piece that lets features like Magic Eraser, Best Take, Add Me and live translation run instantly on the phone without a round trip to the cloud. Pairing a new ISP with a new TPU on a more efficient node is the kind of change that — if the rumours hold — would most plausibly show up as faster processing of computational photography shots (multi-frame Night Sight, Astrophotography mode) and expanded on-device AI features generally, rather than as a single flashy new spec. Google hasn't detailed exact NPU performance figures in the leaks so far, so treat any specific throughput claims as unverified.
Rounding out the leaked silicon: a Titan M3 security chip (up from Titan M2 on the Pixel 9) and, notably, a MediaTek M90 modem rather than the Samsung/Exynos-derived modems Tensor chips have used previously. A modem supplier switch, if it holds, could affect real-world signal performance and 5G band support — an area where Tensor phones have had a mixed reputation — though this is genuinely too early to call either way.
Camera system: rumoured sensor and feature changes
Camera leaks for the Pixel 11 series are more granular than usual, likely because retail marketing assets have reportedly already started circulating ahead of the 12 August event. Treat sensor resolutions as the most reliable part of any leak (they tend to come from component sourcing) and feature claims as the least reliable (they tend to be inferred or guessed).
Base Pixel 11
The standard Pixel 11 is rumoured to move to a new 50MP main sensor, reportedly codenamed "chemosh", up from the Pixel 10's 48MP primary sensor. A 2MP increase alone wouldn't be a meaningful story, but leaks suggest the new sensor could also bring a larger individual pixel size and a wider aperture — changes that generally matter more for low-light image quality than the megapixel count itself. If true, this would represent the base Pixel finally closing some of the historical gap to the Pro models' camera hardware, a gap Google has narrowed gradually over several generations.
Pixel 11 Pro and Pro XL
The Pro models are rumoured to receive entirely new main and telephoto sensors, reportedly codenamed "bastet" and "barghest". Detailed resolution and aperture figures for these two sensors haven't surfaced with confidence at the time of writing, so any specific numbers circulating online should be read as speculative pending official confirmation.
What has surfaced with more visual evidence is a possible physical redesign of the telephoto module. Recent Pixel 11 Pro renders reportedly show a circular telephoto camera cutout, a departure from the square periscope housing used on the Pixel 10 Pro. Leakers have floated two possibilities: a switch to an "All Lenses on Prism" (ALoP) layout similar to the approach Samsung uses on its current Ultra-tier flagship, or a shift from the L-shaped periscope light path used on recent Pixel Pro models to an M-shaped path. Either would be a genuine internal redesign of the zoom module, not just a sensor swap — and, as covered below, redesigns like this are historically the kind of change that makes camera modules costlier and fussier to source and fit correctly.
Zoom and computational photography claims
Leaked marketing imagery reportedly references up to 30x zoom on the Pixel 11 series. This is worth treating carefully: earlier, separate leaks had floated a 64MP periscope telephoto with up to 10x optical zoom, and Google's current Pixel 10 already advertises up to 100x "Pro Res Zoom" as a software-assisted digital figure on top of a 5x optical telephoto. Where a rumoured "30x" figure sits relative to optical versus digital zoom, or whether it refers to a specific quality-assured tier within a larger digital range, isn't yet clear from the leaks — it may simply be marketing shorthand that gets clarified at launch. We'd treat any specific zoom multiplier as unconfirmed until Google's own materials are published.
Also worth noting: at least one leak suggests the Pixel 11 series drops a rear temperature sensor feature present on recent Pro models — a minor hardware omission rather than an upgrade, and a reminder that not every year-on-year change is a step forward. On the AI side, a new ISP and TPU combination would plausibly support faster or expanded versions of existing computational features (multi-frame blending, real-time subject isolation, on-device video enhancement), but no specific new camera modes have been confirmed by Google, so we're not going to invent feature names here.
How big a jump is this, really? Comparing to the confirmed Pixel 10
The most useful baseline for judging these rumours isn't the two-generations-old Pixel 9 — it's the Pixel 10, which is the actual current-generation Pixel and the phone the Pixel 11 will directly replace. For wider context, the Pixel 9's Tensor G4 (built on a 4nm process, with a 50MP primary camera at f/1.68) is included below to show the trajectory across three generations.
| Spec | Pixel 9 (Tensor G4) — confirmed | Pixel 10 (Tensor G5) — confirmed | Pixel 11 (Tensor G6) — rumoured |
|---|---|---|---|
| Process node | 4nm | 3nm (TSMC, first Tensor made by TSMC) | 2nm (TSMC), rumoured |
| Main camera | 50MP, f/1.68 | 48MP primary sensor | 50MP "chemosh" sensor, rumoured |
| Telephoto | Not on base model | 10.8MP, 5x optical, up to 100x Pro Res Zoom (digital) | New sensor rumoured, up to 30x referenced in leaked marketing (metric unclear) |
| CPU performance claim | Baseline | Google claims ~34% faster CPU vs Tensor G4 | Early Geekbench leak suggests further single-core uplift; core count reportedly drops by one |
| ISP / AI accelerator | Previous-generation ISP/TPU | New ISP, +60% TPU performance claimed by Google vs G4 | New ISP ("Metis") and new TPU ("Santafe") rumoured |
Read across that table, the honest takeaway is that the Tensor G5/Pixel 10 generation already delivered a substantial, confirmed jump — new foundry partner, new process node, genuinely improved ISP with default 10-bit video. If the Tensor G6 rumours hold, the Pixel 11 would be a second consecutive process-node jump in as many years (3nm to 2nm), which is an aggressive cadence by industry standards. Whether that translates into a camera and AI experience that feels as different to end users as the underlying silicon suggests is something only hands-on review units will settle — and those won't exist until after the 12 August event.
What more complex camera modules have historically meant for repairs
This is general industry pattern, not a confirmed Pixel 11 repair price — Google hasn't published parts pricing for a phone that doesn't exist yet, and we wouldn't invent figures. But the pattern across recent smartphone generations, Pixel included, is consistent: as camera systems gain more sensors, larger sensor sizes, and folded periscope-style zoom modules, the modules themselves become more expensive to source and noticeably fussier to fit correctly. Real, confirmed examples from the Pixel line back this up — component pricing for Pixel 8 and Pixel 8 Pro camera parts rose meaningfully compared with the Pixel 7 generation, with rear camera modules moving into the $140–$200 range at the higher end, largely because of the added sensor complexity and tighter assembly tolerances involved.
Periscope and prism-based telephoto modules are a particular case in point. They rely on an internal mirror or prism to fold the optical path inside a thin phone body, which means alignment tolerances are tighter than for a conventional straight-through lens stack — a small mounting error can visibly affect autofocus or optical image stabilisation. If the rumoured shift from an L-shaped to an M-shaped periscope path, or a move to an ALoP-style layout, materialises on the Pixel 11 Pro and Pro XL, it would fit the general pattern of newer zoom architectures requiring more precision-dependent handling than the modules they replace — again, a pattern, not a confirmed Pixel 11 outcome.
For anyone who works at the component level on phones generally — whether that's screen, battery or camera module work — having the right precision bit set matters more as tolerances get tighter. Our 38 in 1 Professional Multi Purpose Screw Driver Repair Tools Premium (£4.99) covers the range of Torx, Phillips and Pentalobe bits typically needed for modern smartphone disassembly, and is a sensible baseline toolkit regardless of which Pixel generation you're working on. For general Pixel disassembly and precision-handling principles that apply across models, see our Google Pixel screen repair guide.
Frequently asked questions
Is the Google Pixel 11 officially announced yet?
No. Google has confirmed a Made by Google event for 12 August 2026, with retail availability widely expected shortly after. Until that event, all specs discussed here — chip and camera alike — remain rumoured or leaked rather than official.
Is the Tensor G6's 2nm process confirmed?
Not officially. Multiple leaks describe the Tensor G6 as being built on TSMC's 2nm-class (N2) process, reportedly making it one of the first smartphone chips on that node. Google has not confirmed the process node publicly at the time of writing.
What is the rumoured Pixel 11 main camera sensor?
Leaks point to a new 50MP main sensor codenamed "chemosh" on the base Pixel 11, up from the Pixel 10's 48MP sensor, with rumoured improvements to pixel size and aperture. The Pixel 11 Pro and Pro XL are separately rumoured to get new sensors codenamed "bastet" and "barghest".
How does the rumoured Pixel 11 camera compare with the current Pixel 10?
The Pixel 10, released in 2025, is confirmed to use a 48MP primary sensor alongside a 13MP ultrawide and a 10.8MP telephoto with 5x optical zoom. The Pixel 11 is rumoured to bump the main sensor to 50MP on the base model and introduce entirely new sensors on the Pro models, but exact resolution and aperture figures for the Pro cameras haven't been confirmed.
Will a smaller chip process genuinely improve battery life?
Smaller process nodes generally allow transistors to switch faster while using less power and leaking less current when idle, which is why manufacturers chase them. Whether that translates into noticeably better real-world battery life on the Pixel 11 depends on how Google tunes clock speeds and background AI workloads — a smaller node alone doesn't guarantee a battery life improvement.
Does E-Tech61 sell Pixel 11 parts or accessories?
Not yet. E-Tech61 currently holds no Pixel 11 stock, as the phone hasn't launched. We're a parts supplier, not a repair shop, and we'll list genuine Pixel 11 parts once the range is officially available. In the meantime, see our full Pixel 11 series overview for release and pricing rumours.
Which Pixel 11 model should I wait for?
That depends on which rumoured camera and chip changes matter most to you — the base model's new main sensor, or the Pro models' redesigned telephoto system. See our Pixel 11 tier comparison for a full breakdown once more specs are confirmed.

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